Major Equipment
Optical lithography laboratory: Two contact mask aligners, a laser direct writer with an interferometer stage, resist spinners, high power optical microscopes, and resist baking ovens. Electron beam lithography laboratory: Leica EBPG-5000plus electron beam writing system with a 20nm spotsize, field stitching and overlay accuracy of 30 nm. Field-emission Hitachi S-4500 electron microscope with a spot size of 0.9 nm and automatic alignment mark detection and stage control for high resolution beam-writing facility, high voltage (300 kV) Philips EM-430 scanning transmission electron microscope, a 30 kV Hitachi S-520 analytical scanning electron microscope and a ISI-30 microscope. The commercial Leica EBPG-5000+ electron beam lithography system with a 6 inch wafer capability and 0.6nm sample positioning stage will also be delivered during the summer of 2003. Other lithographic capabilities: Sub-100 nm projection lithography systems also include a new electron image projection lithography system with a 4 Tesla high-field warm bore magnet. A 25 kV focussed ion (Ga+) ion beam system with a reactive gas introduction system for maskless etching. Pattern transfer laboratory: ICP reactive ion etching (RIE) system, diode RIE system, plasma etching system, two reactive ion beam etching systems, two chemically assisted ion beam etching systems. Metallization and deposition equipment: Two reactive magnetron r-f sputter deposition systems and a d-c magnetron metal deposition system. Two E-beam and four thermal evaporators for thin film deposition and an Alpha-Step 200 surface profilometer are also located within this facility. Optical Measurement Systems: A optical measurement laboratory with laser table, liquid He cryostat, Boxcar integrators and spectrometers is also available for characterization. In addition, optical measurement capabilities include a near-field optical microscope (NSOM/AFM) and a ultra-fast optical parametric oscillator tuneable laser from Spectra Physics, as well as fast detectors, optical spectrum analysers and high-speed electronics.
General Processing Laboratory
With our nanofabrication instruments, we have demonstrated features with lateral dimensions below 10 nm, with center spacings as small as 25 nm. The etching and deposition facilities now allow us to deposit silicon dioxide and silicon nitride mask and transfer patterns with high fidelity into SI, GaAs, GaAsP, AlAs, InP, InGaAs, Gan, InGaN, Si3N4, and SiO2. The combination of the on these systems has allowed us to perform the fabrication shown in this proposal. In addition, we have developed microplating and anodization and replication facilities for advanced electrochemical microfabrication. Replication molding equipment has also been designed and installed for multilayer soft lithography.
Clean-room Lithography
Apparatus for nanofabrication is presently located within a 1500 square foot cleanroom. This comprises three separate laboratories for lithography, for electron beam lithography. and for thin film processing. The optical lithography laboratory includes a contact mask aligner, resist spinners, a high power optical microscope, and ovens - all situated within class 100 laminar flow hoods.
